





Research and development for reliability and failure diagnsotics of microelectronic and microsytem components, solar cells and organic electronic devices
Fraunhofer IWMH has developed particular experience for more than ten years in the development and application of high-resolution failure localization and failure diagnostic methods, micromechanical testing approaches and numerical simulation of micro components. In close cooperation with manufacturers of microelectronic and testing devices, these methods were applied for physical failure analysis, design for reliability approaches, and more material research application in the fields of IC manufacturing, sensor development, packaging and organic electronics.

Fraunhofer Institut für Werkstoffmechanik